MIJING

Expansion Module FunctionModule A: Multifunctional Bezel Separating Expansion For CPU chip removal, Face ID dot matrix and Touch-ID repairModule MS1-11: For IP X/XS/XS Max/11/11 Pro/11 Pro Max motherboards, preheating and desolderingModule MS1-12: For IP 12 Series motherboards, preheating and desold..

1. MJ 18 in 1 BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for iPhone X-14PM, iPhone X-14PM motherboard BGA reballing fixture tool, is used for positioning and reballing iPhone X- 14PM PCB BGA parts, convenient and faster for reballing BGA..